
2 Chapter 1: Overview
1.2 Features
Enclosure
• Industry 19” rack-mountable 1U
chassis storage bay
– (4) 3.5” HDD bays
– (1) DVD-ROM Bay
• Dimension: D 22.4 x W 17.2 x H
1.72 inch (568x436x43.6mm)
Processor
• Supports up to two Intel
®
Xeon
5100/5200/5400 processors
• Dual LGA 771 sockets
• 1066/1333MHz FSB
Chipsets
• Intel 5100 (San Clemente) MCH
• Intel ICH9-R South Bridge
• Winbond 83627DHG Super I/O
Chip
Memory
• Supports eight (8) 240-pin DDR2
DIMM sockets
• Maximum of 32GB DDR2-533/667
memory
• Supports Registered ECC DIMMs
Video
•XGI
®
Z9S PCI graphics controller
• 32MB DDR2 frame buffer of video
memory
Storage
• Hard Disk Drives:
– Support (4), SATA/SATA2 HDD
with RAID 1, 0, 5, 0+1
– Pre-installed SATA DVD-ROM
Expansion Slot
• One (1) PCI-E x16 riser (M2083
pre-installed)
Motherboard
• TYAN S5375G2NR
• CEB footprint (12 x 10.5”)
Back I/O Ports
• Stacked PS/2 mouse & keyboard
ports
• Stacked two USB 2.0
• One (1) 15-pin VGA port
• One (1) 9-pin COM port
• Two (2) RJ-45 10/100/1000 ports
• One (1) RJ-45 port for M3295-2 /
M3296 (optional)
Front Panel Features
•I/O
– (2) USB 2.0 ports
•LED indicators
– Power LED
– (2) LAN LEDs
– HDD active LEDs
– Warning LED
–ID LED
• Switches
– Power
– Reset
–NMI
–ID
Networking
• Two (2) LAN ports
– Two (2) 82573V (via PCI-E x1
signal)
Server Management
• System fan speed monitoring and
control
• Supports TYAN Server Manage-
ment (TSM)
• Optional TYAN SMDC M3295-2 /
M3296, IPMI 2.0 compliant
• Support TYAN LCM Module
BIOS
• AMI BIOS on 8Mbit Flash ROM
• Supports ACPI 2.0
• Supports boot from USB device
• WOL and PXE support
• Power-on mode control for AC
power loss recovery
• PnP, DMI2.0, WfM2.0 Power Man-
agement (S1, S4, S5 support)
• Serial Console Redirect
System Cooling
• Four (4) 40*40*56mm 15000rpm &
one (1) 40*40*28mm 15000rpm
heavy-duty fans with fan speed
monitor/control
• Two (2) Passive CPU heatsinks
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